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Cisco Intel Xeon Silver 4509Y processor 2.6 GHz 22.5 MB
SKU
UCSX-CPU-I4509Y
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Out Of Stock - Contact for availability
Intel Xeon Silver 4509Y Processor 22.5M Cache, 2.60 GHz
| SKU | UCSX-CPU-I4509Y |
|---|---|
| Manufacturer | Cisco |
| Availability | Out of Stock |
The Xeon® Processor from Cisco is designed to deliver enhanced reliability and flexibility for server platforms. This processor offers excellent performance and headroom for peak Internet server loads, resulting in faster response times, support for more users and improved scalability.
| Processor | |
|---|---|
| Processor generation | Intel Xeon Scalable 5th Gen |
| Processor base frequency | 2.6 GHz |
| Processor manufacturer | Intel |
| Cooler included | No |
| Processor codename | Sapphire Rapids |
| Thermal Design Power (TDP) | 125 W |
| Processor cache | 22.5 MB |
| Processor model | 4509Y |
| Processor threads | 16 |
| Processor boost frequency | 4.1 GHz |
| Processor family | Intel® Xeon® |
| Processor cores | 8 |
| Processor socket | LGA 4677 (Socket E) |
| Intel® UPI Speed | 16 GT/s |
| Memory | |
| Maximum internal memory supported by processor | 4 TB |
| Memory types supported by processor | DDR5-SDRAM |
| Memory channels | Octa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 125 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 5.0 |
| Supported instruction sets | AMX, AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | 2S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 125 W |
| Status | Launched |
| Market segment | Server |
| Launch date | Q4'23 |
| Intel Virtualization Technology (VT-x) | Yes |
| Number of UPI links | 2 |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Package carrier | E1B |
| Features | |
|---|---|
| Maximum number of PCI Express lanes | 80 |
| Thermal Design Power (TDP) | 125 W |
| Processor package size | 77.5 x 56.5 mm |
| Execute Disable Bit | Yes |
| PCI Express slots version | 5.0 |
| Supported instruction sets | AMX, AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | 2S |
| Embedded options available | Yes |
| Market segment | Server |
| Use conditions | Server/Enterprise |
| Processor special features | |
| Intel Software Guard Extensions (Intel SGX) | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® OS Guard | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Boot Guard | Yes |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) on CPU | Yes |
| Mode-based Execute Control (MBE) | Yes |
| Intel® Resource Director Technology (Intel® RDT) | Yes |
| Intel® Transactional Synchronization Extensions | Yes |
| Intel® Total Memory Encryption | Yes |
| Intel® Control-flow Enforcement Technology (CET) | Yes |
| Intel® Platform Firmware Resilience Support | Yes |
| Intel® Crypto Acceleration | Yes |
| Intel® Total Memory Encryption - Multi Key | Yes |
| Intel® QuickAssist Software Acceleration | Yes |
| Intel® Data Streaming Accelerator (DSA) | 1 default devices |
| Intel® Advanced Matrix Extensions (AMX) | Yes |
| Operational conditions | |
| Tcase | 84 °C |
| DTS Max | 100 °C |
| Weight & dimensions | |
| Processor package size | 77.5 x 56.5 mm |
| Other features | |
| Maximum internal memory | 4 TB |
