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Hewlett Packard Enterprise Intel Xeon Gold 6142M processor 2.6 GHz 22 MB L3
SKU
874760-B21
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Out Of Stock - Contact for availability
Intel Xeon Gold 6142M, 22M Cache, 2.6 GHz, 150 W TDP, w/ Performance Heatsink
| Processor socket | LGA 3647 (Socket P) |
|---|---|
| Processor cores | 16 |
| Processor family | Intel Xeon Gold |
| Processor lithography | 14 nm |
| SKU | 874760-B21 |
| EAN | 0190017163987 |
| Manufacturer | HPE |
| Availability | Out of Stock |
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| Processor | |
|---|---|
| Processor base frequency | 2.6 GHz |
| Cooler included | No |
| Processor codename | Skylake |
| Thermal Design Power (TDP) | 150 W |
| Processor cache | 22 MB |
| Processor model | 6142M |
| Processor threads | 32 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.7 GHz |
| Stepping | H0 |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 16 |
| Processor socket | LGA 3647 (Socket P) |
| Processor series | Intel Xeon Gold 6000 Series |
| Processor cache type | L3 |
| Memory | |
| Maximum internal memory supported by processor | 1500 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2666 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| On-board graphics card | No |
| Power | |
| Thermal Design Power (TDP) | 150 W |
| Technical details | |
|---|---|
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | S4S |
| Embedded options available | No |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 150 W |
| Processor series | Intel Xeon Gold 6000 Series |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 150 W |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | S4S |
| Embedded options available | No |
| Market segment | Server |
| Processor special features | |
| Intel 64 | Yes |
| Conflict-Free processor | Yes |
| Intel® Speed Shift Technology | Yes |
| Intel® Optane™ Memory Ready | No |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Operational conditions | |
| Tcase | 85 °C |
| Other features | |
| Compatibility | DL380 Gen10 |