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Lenovo Intel Xeon Gold 6226 processor 2.7 GHz 19.25 MB
SKU
4XG7A38021
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Out Of Stock - Contact for availability
Intel Xeon Gold 6226, 19.25M Cache, 2.70 GHz
| Processor socket | LGA 3647 (Socket P) |
|---|---|
| Processor cores | 12 |
| Processor family | Intel Xeon Gold |
| Processor lithography | 14 nm |
| SKU | 4XG7A38021 |
| EAN | 0889488503209 |
| Manufacturer | Lenovo |
| Availability | Out of Stock |
| Processor | |
|---|---|
| Processor generation | 2nd Generation Intel® Xeon® Scalable |
| Processor base frequency | 2.7 GHz |
| Processor codename | Cascade Lake |
| Thermal Design Power (TDP) | 125 W |
| Processor cache | 19.25 MB |
| Processor model | 6226 |
| Processor threads | 24 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.7 GHz |
| Number of QPI links | 3 |
| Bus type | UPI |
| Component for | PC |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Gold |
| Processor cores | 12 |
| Processor socket | LGA 3647 (Socket P) |
| Memory | |
| Maximum internal memory supported by processor | 1 TB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2933 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 125 W |
| Technical details | |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | 4S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 125 W |
| Market segment | Desktop |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Features | |
|---|---|
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 125 W |
| Processor package size | 76 x 56.5 mm |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | 4S |
| Embedded options available | Yes |
| Market segment | Desktop |
| Harmonized System (HS) code | 85423119 |
| Processor special features | |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® Volume Management Device (VMD) | Yes |
| Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
| Intel® Optane™ DC Persistent Memory Supported | Yes |
| Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
| Intel® vPro™ Platform Eligibility | Yes |
| Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
| Operational conditions | |
| Tcase | 86 °C |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |
| Weight & dimensions | |
| Processor package size | 76 x 56.5 mm |
| Other features | |
| Compatibility | ThinkSystem SR550/SR590/SR650 |