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Lenovo Intel Xeon Gold 6226R processor 2.9 GHz 22 MB
SKU
4XG7A63292
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Out Of Stock - Contact for availability
Intel Xeon Gold 6226R, 22M Cache, 2.90 GHz, w/o Fan
Processor socket | LGA 3647 (Socket P) |
---|---|
Processor cores | 16 |
Processor family | Intel Xeon Gold |
Processor lithography | 14 nm |
SKU | 4XG7A63292 |
EAN | 0889488519910 |
Manufacturer | Lenovo |
Availability | Out of Stock |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.9 GHz |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 150 W |
Processor cache | 22 MB |
Processor model | 6226R |
Processor threads | 32 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.9 GHz |
Number of QPI links | 2 |
Bus type | UPI |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® Gold |
Processor cores | 16 |
Processor socket | LGA 3647 (Socket P) |
Memory | |
Maximum internal memory supported by processor | 1 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 150 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Thermal Design Power (TDP) | 150 W |
Market segment | Server |
Intel Virtualization Technology (VT-x) | Yes |
Features | |
---|---|
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 150 W |
Processor package size | 76 x 56.5 mm |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
Intel® Optane™ DC Persistent Memory Supported | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
Operational conditions | |
Tcase | 85 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 76 x 56.5 mm |
Other features | |
Compatibility | ThinkSystem SR570/SR630 |